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专利名称：Method of measuring an adhesive force of
interlayer adhesive layer in tensile mode forstacked semiconductor device andapparatus for measuring the same
发明人：Dong Kil Shin,Chul Keun Yoon,Min Kyu
Kang,Gyu Jei Lee
申请号：US15002215申请日：20160120公开号：US09945772B2公开日：20180417
专利附图：
摘要：A method includes providing a device under test, which includes a lower testlayer and an upper test layer that is stacked on the lower test layer and includes anoverhang protruding past an edge of the lower test layer by a predetermined length,fixing the lower test layer onto a mounting stage, and measuring adhesive force of aninterlayer adhesive layer in a tensile mode by applying a load to a bottom surface of theoverhang of the upper test layer in a first direction. An apparatus includes a mountingstage fixing the device under test, a load applying tip applying the load to the bottomsurface of the overhang, a location adjuster adjusting a distance between the deviceunder test and the load carrying tip, a load cell detecting a magnitude of the appliedload, and a controller controlling the location adjuster and the load cell.
申请人：SK hynix Inc.,Industry-Academic Cooperation Foundation, Yeungnam University
地址：Icheon KR,Gyeongsan KR
国籍：KR,KR
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