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专利名称：Polishing apparatus
发明人：Hideo Aizawa,Masao Umemoto,Tadakazu
Sone,Ryuichi Kosuge
申请号：US14792062申请日：20150706公开号：US09522453B2公开日：20161220
专利附图：
摘要：A polishing apparatus which can continue stable operation of the apparatuswithout generating torsional vibration in a rotary joint and without generating anabnormal sound at an engagement part between a cooling water pipe and a polishing
table is disclosed. The polishing apparatus includes a rotary joint fixed to a rotating partof the polishing table or a rotating part of the top ring to supply a fluid into the polishingtable or the top ring and discharge the fluid from the polishing table or the top ring, anda rotation-prevention mechanism which connects the rotary joint with an apparatus frameto prevent the rotary joint from being rotated. The rotation-prevention mechanismincludes a link mechanism having at least one spherical plain bearing.
申请人：EBARA CORPORATION
地址：Tokyo JP
国籍：JP
代理机构：Pearne & Gordon LLP
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