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专利名称：Polishing apparatus
发明人：Tatsuya Sasaki,Tomohiko Akatsuka,Kazuto
Hirokawa
申请号：US10491539申请日：20021101
公开号：US20050009456A1公开日：20050113
专利附图：
摘要：A polishing apparatus polishes a workpiece such as a semiconductor wafer. Thepolishing apparatus comprises a table () which makes a motion, a base () placed on thetable, a polishing tool () fixed to the base and having a polishing surface for polishing a
surface of the workpiece (W), a plurality of transmission members () provided along acircumferential direction of the table, and a plurality of holes () formed in the base. Thetransmission members are inserted into the holes, respectively, for transmitting themotion of the table to the base.
申请人：Tatsuya Sasaki,Tomohiko Akatsuka,Kazuto Hirokawa
地址：Tokyo JP,Tokyo JP,Tokyo JP
国籍：JP,JP,JP
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