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专利名称：Polishing apparatus
发明人：Koji Ono,Shozo Oguri,Kenichi Sasabe,Masato
Kurita,Yasuhisa Kojima,TadanoriEgawa,Kenichi Shigeta
申请号：US104766申请日：20030821公开号：US06997778B2公开日：20060214
专利附图：
摘要：A polishing apparatus comprises a polishing tool, a substrate holding member,and a sensor for detecting a failure of a substrate to be polished.
申请人：Koji Ono,Shozo Oguri,Kenichi Sasabe,Masato Kurita,Yasuhisa Kojima,TadanoriEgawa,Kenichi Shigeta
地址：Kanagawa-ken JP,Kanagawa-ken JP,Tokyo JP,Kanagawa-ken JP,Kanagawa-kenJP,Kanagawa-ken JP,Kanagawa-ken JP
国籍：JP,JP,JP,JP,JP,JP,JP
代理机构：Wenderoth, Lind & Ponack, L.L.P.
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