专利内容由知识产权出版社提供
专利名称：Polishing apparatus
发明人：Kenji Kamimura,Norio Kimura,Satoshi
Okamura,Hideo Aizawa,MakotoAkagi,Katsuhiko Tokushige,HisanoriMatsuo,Manabu Tsujimura
申请号：US11113084申请日：20050425
公开号：US20050191949A1公开日：20050901
专利附图：
摘要：The present invention relates to a polishing apparatus for polishing a
workpiece, such as a semiconductor wafer, to a flat mirror finish. The polishing apparatuscomprises a polishing table having a polishing surface, and a top ring, and the workpieceis interposed between the polishing table and the top ring and pressed at a
predetermined pressure to polish the workpiece. The polishing apparatus comprises atleast two dressing units for dressing the polishing surface by being brought into contactwith the ppolishing surface, which is a surface of a polishing cloth.
申请人：Kenji Kamimura,Norio Kimura,Satoshi Okamura,Hideo Aizawa,MakotoAkagi,Katsuhiko Tokushige,Hisanori Matsuo,Manabu Tsujimura
地址：Tokyo JP,Tokyo JP,Tokyo JP,Tokyo JP,Tokyo JP,Tokyo JP,Tokyo JP,Tokyo JP
国籍：JP,JP,JP,JP,JP,JP,JP,JP
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