专利内容由知识产权出版社提供
专利名称：Polishing apparatus
发明人：Kunihiko Sakurai,Tetsuji Togawa,Nobuyuki
Takada,Satoshi Wakabayashi,KenichiroSaito,Masahiko Sekimoto,TakujiHayama,Daisuke Koga
申请号：US10026763申请日：20011227
公开号：US20020045410A1公开日：20020418
专利附图：
摘要：A polishing apparatus is used for polishing a workpiece such as a semiconductor
wafer to a flat mirror finish. The polishing apparatus comprises a turntable having apolishing surface, a top ring for holding a workpiece and pressing the workpiece againstthe polishing surface to polish the workpiece, at least three cleaning apparatuses forcleaning polished workpieces, and a transfer structure for transferring the polishedworkpieces between at least three cleaning apparatuses. The polishing apparatus furtherincludes a rotary transporter disposed in a position which can be accessed by said toprings and having a plurality of portions positioned on a predetermined circumferencefrom a center of rotation of the rotary transporter for holding the workpieces.
申请人：SAKURAI KUNIHIKO,TOGAWA TETSUJI,TAKADA NOBUYUKI,WAKABAYASHISATOSHI,SAITO KENICHIRO,SEKIMOTO MASAHIKO,HAYAMA TAKUJI,KOGA DAISUKE
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