Preliminary
FSUSB20 Low Voltage Ultra Low Power USB High Speed (480 Mbps) Dual DPDT Switch (Preliminary)March 2005Revised April 2005
FSUSB20
Low Voltage Ultra Low Power
USB High Speed (480 Mbps) Dual DPDT Switch (Preliminary)
General Description
FSUSB20 is a low power high bandwidth analog switchspecially designed for applications of the switching of highspeed USB 2.0 signals in handset and consumer applica-tions such as cell phone, digital camera, and notebook withhubs or controllers of limited USB I/O. The wide bandwidth(!720MHz) of this switch allows signals to pass with mini-mum edge and phase distortion. Superior channel-to-chan-nel crosstalk results in minimal interference. It iscompatible with high speed USB2.0 standard.
Features
s30dB OFF Isolation at 250MHz
s30dB non-adjacent channel crosstalk at 250MHzs4.5: typical On Resistance (RON)s3dB bandwidth: !720MHzsLow power consumption (1uA max)sControl input: LVTTL compatiblesBidirectional operation
sUSB high speed and full speed signaling capability
Applications
•Cell phone, PDA, digital camera, and notebook
Ordering Code:
Order NumberFSUSB20L10X(Preliminary)FSUSB20BQX
Package Number
MAC010AMLP014A
Package Description
Pb-Free 10-Lead MicroPak, 1.6 mm x 2.1mm
Pb-Free 14-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC MO-241, 2.5 x 3.0mm
Pb-Free package per JEDEC J-STD-020B.
MicroPak¥ is a trademark of Fairchild Semiconductor Corporation.
© 2005 Fairchild Semiconductor CorporationDS500914www.fairchildsemi.com
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Preliminary
FSUSB20Analog Symbol
Connection Diagrams
Pad Assignments for MicroPak
(Top View)
Pad Assignments for DQFN
Pin Descriptions
Pin Name
OESAB1–B2
DescriptionBus Switch Enable
Select InputBusABus B
Truth Table
SXLH
OEHLL
FunctionDisconnectA B1A B2
(Top Through View)
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Preliminary
FSUSB20Absolute Maximum Ratings(Note 1)
Supply Voltage (VCC)DC Switch Voltage (VS)DC Input Voltage (VIN) (Note 2)DC Input Diode Current (lIK) VIN 0VDC Output (IOUT) Sink Current DC VCC/GND Current (ICC/IGND)Storage Temperature Range (TSTG)ESD
Human Body ModelAll PinsI/O to GND
4kV5kV
0.5V to 4.6V0.5V to VCC 0.05V
0.5V to 4.6V
50 mA50 mA
Recommended OperatingConditions (Note 3)
Power Supply Operating (VCC)Input Voltage (VIN)Output Voltage (VOUT)Input Rise and Fall Time (tr, tf)Switch Control InputSwitch I/O
Free Air Operating Temperature (TA)
0 ns/V to 5 ns/V0 ns/V to DC3.0V to 3.6V0V to VCC0V to VCC
r100 mA
65qC to 150 qC
40 qC to 85 qC
Note 1: The Absolute Maximum Ratings are those values beyond whichthe safety of the device cannot be guaranteed. The device should not beoperated at these limits. The parametric values defined in the ElectricalCharacteristics tables are not guaranteed at the absolute maximum rating.The Recommended Operating Conditions tables will define the conditionsfor actual device operation.
Note 2: The input and output negative voltage ratings may be exceeded ifthe input and output diode current ratings are observed.
Note 3: Unused control inputs must be held HIGH or LOW. They may notfloat.
DC Electrical Characteristics
SymbolVIKVIHVILIIIOFFRON
Parameter
Clamp Diode VoltageHIGH Level Input VoltageLOW Level Input VoltageInput Leakage CurrentOFF-STATE Leakage CurrentSwitch On Resistance(Note 5)
VCC(V)3.03.0 - 3.63.0 - 3.63.63.63.03.0
'RONRFLAT(ON)ICC
Delta RON
On Resistance Flatness (Note 6)Quiescent Supply Current
3.03.03.6
5.04.50.31.0
1.31.0
2.0
0.8r1.0r1.07.06.5
TA 40 qC to 85 qCMin
Typ(Note 4)
Max1.2
UnitsVVVPAPA::::PA
0 d VIN d 3.6V0 d A, B d VCCVIN 0.8VION 8 mAVIN 3.0VION 8 mA
VIN 0.8V, VIN 0V - 1.5V, ION 8 mAIOUT 8 mA
VIN VCC or GND, IOUT 0IIN 18 mA
Conditions
Note 4: Typical values are at VCC 3.0V and TA 25qC
Note 5: Measured by the voltage drop between A and B pins at the indicated current through the switch. On Resistance is determined by the lower of thevoltages on the two (A or B) pins.
Note 6: Flatness is defined as the difference between the maximum and minimum value On Resistance over the specified range of conditions.
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Preliminary
FSUSB20AC Electrical Characteristics
SymboltONtOFFtPDOIRRXTALKBW
Parameter
Turn ON Time S-to-Bus BTurn OFF Time S-to-Bus BPropagation Delay
Non-Adjacent OFF-IsolationNon-Adjacent Channel Crosstalk3dB Bandwidth
VCC(V)3.0 to 3.63.0 to 3.63.0 to 3.63.0 to 3.63.0 to 3.63.0 to 3.6
TA 40qC to 85qCMin
Typ(Note 7)4.82.20.2528.030.0750
Max7.04.0
UnitsnsnsnsdBdBMHz
VB 0.8VVB 0.8VCL 10 pF
f 250MHz, RL 50:RL 50:, f 250MHzRL 50:
Conditions
FigureNumberFigures 5, 6Figures 5, 6Figure 10Figure 7Figure 8Figure 9
Note 7: Typical values are at VCC 3.3V and TA 25qC
USB Related AC Electrical Characteristics (Note 8)
SymboltSK(O)tSK(P)TJ
Parameter
Channel-to-Channel SkewSkew of Opposite Transition of the Same OutputTotal Jitter
3.0 to 3.6
0.210
ns
RL 50:, CL 10 pFtR tF 750ps at 480 Mbps
Note 8: Typical values are at VCC 3.3V and TA 25qC
VCC(V)3.0 to 3.63.0 to 3.6
TA 40qC to 85qCMin
Typ0.0510.020
Max
Unitsnsns
CL 10 pFCL 10 pF
Conditions
FigureNumberFigures 10, 11Figures 10, 11
Capacitance (Note 9)
SymbolCINCONCOFF
Parameter
Control Pin Input CapacitanceA/B ON CapacitancePort B OFF Capacitance
TA 40qC to 85qC
Typ2.512.04.0
UnitspFpFpF
VCC 0V
VCC 3.3V, OE 0VVCC and OE 3.3V
Conditions
Note 9: Typical values are at VCC 3.3V and TA 25qC
FIGURE 1. Gain vs. Frequency
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Preliminary
FSUSB20FIGURE 2. OFF Isolation
FIGURE 3. Crosstalk
FIGURE 4. RON
5
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Preliminary
FSUSB20AC Loading and Waveforms
Note: Input driven by 50: source terminated in 50:Note: CL includes load and stray capacitanceNote: Input PRR 1.0 MHz, tW 500 ns
FIGURE 5. AC Test Circuit
FIGURE 6. AC Waveforms
FIGURE 7. OFF Isolation TestFIGURE 8. Crosstalk Test
FIGURE 9. Bandwidth Test
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Preliminary
FSUSB20AC Loading and Waveforms (Continued)
FIGURE 10. Propagation Delay
Pulse Skew tSK(P)
Output Skew tSK(O)FIGURE 11. Skew Test
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Preliminary
FSUSB20Tape and Reel Specification
Tape Format For Micropak
Package
DesignatorL10X
TapeSectionLeader (Start End)
CarrierTrailer (Hub End)
NumberCavities125 (typ)500075 (typ)
CavityStatusEmptyFilledEmpty
Cover TapeStatusSealedSealedSealed
REEL DIMENSIONS inches (millimeters)
Tape Size8 mm
A7.0(177.8)
B0.059(1.50)
C0.512(13.00)
D0.795(20.20)
N2.165(55.00)
W1
0.331 0.059/0.000(8.40 1.50/0.00)
W20.567(14.40)
W3
W1 0.078/0.039(W1 2.00/1.00)
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Preliminary
FSUSB20Tape and Reel Specification (Continued)
Tape Format for DQFN
Package
Designator
BQX
TapeSectionLeader (Start End)
CarrierTrailer (Hub End)
TAPE DIMENSIONS inches (millimeters)
NumberCavities125 (typ)2500/300075 (typ)
CavityStatusEmptyFilledEmpty
Cover TapeStatusSealedSealedSealed
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Preliminary
FSUSB20Physical Dimensions inches (millimeters) unless otherwise noted
Pb-Free 10-Lead MicroPak, 1.6 mm x 2.1mm
Package Number MAC010A
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Preliminary
FSUSB20 Low Voltage Ultra Low Power USB High Speed (480 Mbps) Dual DPDT Switch (Preliminary)Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
Pb-Free 14-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC MO-241, 2.5 x 3.0mm
Package Number MLP014A
Technology Description
The Fairchild Switch family derives from and embodies Fairchild’s proven switch technology used for several years in its74LVX3L384 (FST3384) bus switch product.
Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied andFairchild reserves the right at any time without notice to change said circuitry and specifications.LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORTDEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILDSEMICONDUCTOR CORPORATION. As used herein:1.Life support devices or systems are devices or systemswhich, (a) are intended for surgical implant into thebody, or (b) support or sustain life, and (c) whose failureto perform when properly used in accordance withinstructions for use provided in the labeling, can be rea-sonably expected to result in a significant injury to theuser.
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2.A critical component in any component of a life supportdevice or system whose failure to perform can be rea-sonably expected to cause the failure of the life supportdevice or system, or to affect its safety or effectiveness.
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