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P2I2305NZG-08SR;中文规格书,Datasheet资料

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P2I2305NZ

3.3V 1:5 Clock Buffer

Functional Description

P2I2305NZ is a low cost high speed buffer designed to accept oneclock input and distribute up to five clocks in mobile PC systems anddesktop PC systems. The device operates at 3.3 V and outputs can runup to 133.33 MHz.

P2I2305NZ is designed for low EMI and power optimization andconsumes less than 32 mA at 66.6 MHz, making it ideal for thelow−power requirements of mobile systems. It is available in an 8−pinSOIC Package over Industrial temperature range.

Features

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MARKING DIAGRAM

8

1SOIC−8D SUFFIXCASE 751

xxALYWG

ALYWGG8••••••••••

One−Input to Five−Output Buffer/Driver

Buffers All Frequencies from DC to 133.33 MHzLow Power Consumption for Mobile ApplicationsLess than 32 mA at 66.6 MHz with Unloaded OutputsInput−Output delay: 6 nS(max)

Output−Output skew less than 250 pSSupply Voltage: 3.3 V ± 0.3 V

Operating Temperature Range: −40°C to +85°C8−pin SOIC Package

These Devices are Pb−Free, Halogen Free/BFR Free and are RoHSCompliant

1= Specific Device Code= Assembly Location= Wafer Lot= Year

= Work Week

= Pb−Free Package

ORDERING INFORMATION

See detailed ordering and shipping information in the packagedimensions section on page 5 of this data sheet.

Block Diagram

BUF_IN

OUTPUT1OUTPUT2OUTPUT3OUTPUT4OUTPUT5

Figure 1. Block Diagram

© Semiconductor Components Industries, LLC, 2012

January, 2012 − Rev. 0

1

Publication Order Number:

P2I2305NZ/D

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P2I2305NZ

PIN CONFIGURATION

BUF_INOUTPUT1OUTPUT2

GND

1234

8765

OUTPUT5OUTPUT4VDDOUTPUT3

Figure 2. P2I2305NZ Pin Configuration (Top View)

Table 1. PIN DESCRIPTION

Pin#12, 3, 5, 7, 8

Pin NameVDDGNDBUF_INOUTPUT [1:5]

3.3 V, Supply VoltageGroundClock InputClock Outputs

Description

Table 2. ABSOLUTE MAXIMUM RATINGS

Parameter

Supply Voltage to Ground PotentialDC Input Voltage (Except REF)DC Input Voltage (REF)Storage Temperature

Max. Soldering Temperature (10 sec)Junction Temperature

Static Discharge Voltage

(As per JEDEC STD22− A114−B)

Min−0.5−0.5−0.5−65

Max+4.6VDD + 0.5

7+1502601502000

UnitVVV°C°C°CV

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above theRecommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affectdevice reliability.

Table 3. OPERATING CONDITIONS

Parameter

VDDTACLCINBUF_IN,OUTPUT [1:5]

tPU

Supply VoltageOperating Temperature

Load Capacitance, Fout < 100 MHz

Load Capacitance, 100 MHz < Fout < 133.33 MHzInput CapacitanceOperating Frequency

Power−up time for all VDD’s to reach minimum specified voltage (powerramps must be monotonic)

DC0.05

Description

Min3.0−40

Max3.68530157133.3350

UnitV°CpFpFpFMHzmS

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2

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P2I2305NZ

Table 4. DC CHARACTERISTICS VDD = 3.0 V to 3.6 V, GND = 0 V, TA = *40°C to +85°C

SymbolVILVIHIILIIHVOLVOHIDD

Parameter

Input LOW Voltage (Note 1)Input HIGH Voltage (Note 1)Input LOW CurrentInput HIGH Current

Output LOW Voltage (Note 2)Output HIGH Voltage (Note 2)Supply Current

VIN = 0 VVIN = VDDIOL = 12 mAIOH = −12 mA

Unloaded outputs at 66.66 MHz

2.4

32

2.2

50.0100.00.4

Test Conditions

Min

Max0.8

UnitVVmAmAVVmA

1.BUF_IN input has a threshold voltage of VDD/2.

2.Parameter is guaranteed by design and characterization. It is not tested in production.

Table 5. AC CHARACTERISTICS (Note 3) VDD = 3.0 V to 3.6 V, GND = 0 V, TA = *40°C to +85°C

Symbolt3t4tDt5t6

Parameter

Rise Time (Note 4)Fall Time (Note 4)

Duty Cycle (Note 4) = t2 B t1Output to Output Skew (Note 4)Propagation Delay, BUF_INRising Edge to OUTPUT RisingEdge (Note 4)

Test Conditions

Measured between 0.8 V and 2.0 VMeasured between 2.0 V and 0.8 VMeasured at 1.4 V (For an Input Clock

Duty Cycle 50%)

All outputs equally loadedMeasured at VDD/2

4

45Min

Typ1.51.550

Max2255±2506

UnitnSnS%pSnS

3.All parameters specified with loaded outputs.

4.Parameter is guaranteed by design and characterization. It is not tested in production.

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3

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P2I2305NZ

SWITCHING WAVEFORMS

Duty Cycle Timing

t1t21.4 VOUTPUT1.4 V1.4 VAll Outputs Rise/Fall Time

2 VOUTPUT0.8 Vt3t42 V0.8 VOutput−Output Skew

1.4 VOUTPUT1.4 VOUTPUTt5Input−Output Propagation Delay

VDD/2INPUTVDD/2OUTPUTt6Figure 3. Switching Waveforms

+3.3 VBUF_IN

VDD0.1 mFGNDCLOUTPUTFigure 4. Test Circuithttp://onsemi.com

4

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P2I2305NZ

ORDERING INFORMATION

Device

P2I2305NZG−08SR

MarkingADB

PackageSOIC−8(Pb−Free)

Shipping†2500 / Tape & Reel

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel PackagingSpecifications Brochure, BRD8011/D.

*A “microdot” placed at the end of last row of marking or just below the last row toward the center of package indicates Pb−Free.

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5

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P2I2305NZ

PACKAGE DIMENSIONS

SOIC−8 NBCASE 751−07ISSUE AK

−X−A85NOTES:

1.DIMENSIONING AND TOLERANCING PERANSI Y14.5M, 1982.

2.CONTROLLING DIMENSION: MILLIMETER.3.DIMENSION A AND B DO NOT INCLUDEMOLD PROTRUSION.

4.MAXIMUM MOLD PROTRUSION 0.15 (0.006)PER SIDE.

5.DIMENSION D DOES NOT INCLUDE DAMBARPROTRUSION. ALLOWABLE DAMBAR

PROTRUSION SHALL BE 0.127 (0.005) TOTALIN EXCESS OF THE D DIMENSION ATMAXIMUM MATERIAL CONDITION.

6.751−01 THRU 751−06 ARE OBSOLETE. NEWSTANDARD IS 751−07.

DIMABCDGHJKMNSMILLIMETERSMINMAX4.805.003.804.001.351.750.330.511.27 BSC0.100.250.190.250.401.270 _8 _0.250.505.806.20INCHESMINMAX0.10.1970.1500.1570.0530.0690.0130.0200.050 BSC0.0040.0100.0070.0100.0160.0500 _8 _0.0100.0200.2280.244B1S40.25 (0.010)

MY

M−Y−GKC−Z−HD0.25 (0.010)

MSEATINGPLANENX 45_0.10 (0.004)MJZY

SX

SSOLDERING FOOTPRINT*

1.520.0607.00.2754.00.1550.60.0241.2700.050SCALE 6:1

mmǓǒinches*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering andMounting Techniques Reference Manual, SOLDERRM/D.

ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further noticeto any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liabilityarising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. Alloperating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patentrights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or otherapplications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur.Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries,affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injuryor death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is anEqual Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

PUBLICATION ORDERING INFORMATION

LITERATURE FULFILLMENT:Literature Distribution Center for ON SemiconductorP.O. Box 5163, Denver, Colorado 80217 USAPhone: 303−675−2175 or 800−344−3860 Toll Free USA/CanadaFax: 303−675−2176 or 800−344−3867 Toll Free USA/CanadaEmail: orderlit@onsemi.comN. American Technical Support: 800−282−9855 Toll FreeUSA/CanadaEurope, Middle East and Africa Technical Support:Phone: 421 33 790 2910Japan Customer Focus CenterPhone: 81−3−5817−1050ON Semiconductor Website: www.onsemi.comOrder Literature: http://www.onsemi.com/orderlitFor additional information, please contact your localSales Representativehttp://onsemi.com6P2I2305NZ/Dhttp://oneic.com/

分销商库存信息:

ONSEMI

P2I2305NZG-08SR

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