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PRINTED CIRCUIT BOARD, AND METHOD AND APPARATUS FO

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专利名称:PRINTED CIRCUIT BOARD, AND METHOD

AND APPARATUS FOR DRILLING PRINTEDCIRCUIT BOARD

发明人:Shandang Liu申请号:US14081569申请日:20131115

公开号:US20140093321A1公开日:20140403

专利附图:

摘要:The present invention relates to a method for drilling a printed circuit board,comprising: drilling down in an initial position, and when contacting a live superficial

conductive layer of a PCB, acquiring a first conductive position and acquiring a first heightdifference between the initial position and the first conductive position; drilling onwardafter the first drill bit of the driller drills through the superficial conductive layer andwhen contacting another conductive layer of the PCB, acquiring a second conductiveposition and acquiring a second height difference between the initial position and thesecond conductive position; calculating a difference between the second and the firstheight difference to obtain a third height difference; and performing back-drilling,according to the third height difference, in a position that needs back-drilling. Thepresent invention acquires precise depth information through a test blind via and reducesStub length of back-drilling.

申请人:Huawei Technologies Co., Ltd.

地址:Shenzhen CN

国籍:CN

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