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专利名称：Thermal transfer structure with in-plane
tube lengths and out-of-plane tube bend(s)
发明人：Amilcar R. Arvelo,Mark A. Brandon,Levi A.
Campbell,Michael J. Ellsworth, Jr.,Randall G.Kemink,Eric J. McKeever
申请号：US13782384申请日：20130301公开号：US09341418B2公开日：20160517
专利附图：
摘要：Cooling apparatuses and coolant-cooled electronic assemblies are provided
which include a thermal transfer structure configured to couple to and cool one or moreelectronic components. The thermal transfer structure includes a thermal spreader, andat least one coolant-carrying tube coupled to the thermal spreader. The coolant-carryingtube(s) includes multiple tube lengths disposed substantially in a common plane, and anout-of-plane tube bend. The out-of-plane tube bend is couples in fluid communicationfirst and second tube lengths of the multiple tube lengths, and extends out-of-planefrom the multiple tube lengths disposed in the common plane. The first and second tubelengths may be spaced apart, with a third tube length disposed between them, and thecoolant-carrying tube(s) further includes an in-plane tube bend which couples in fluidcommunication the third tube length and a fourth tube length of the multiple tubelengths.
申请人：INTERNATIONAL BUSINESS MACHINES CORPORATION
地址：Armonk NY US
国籍：US
代理机构：Heslin Rothenberg Farley & Mesiti P.C.
代理人：Margaret A. McNamara, Esq.,Kevin P. Radigan, Esq.
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