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专利名称：Flip-chip packaging发明人：William Planey申请号：US10215570申请日：20020809公开号：US06747342B1公开日：20040608
专利附图：
摘要：A semiconductor die mounted between an X-lead frame and a supportstructure without bonding wires or straps. A power enhancement mode junction fieldeffect transistor (JFET) die having a top surface defining a drain, and a bottom surfacehaving a first metalized region defining a source and a second metalized region defining a
gate, is positioned on a support structure. An X-lead frame is bonded to the supportstructure such that electrical contact is made with an external lead. Angular projectionsfrom the X-lead frame make contact with the top surface of the JFET, hold the die inplace on the support structure, and form electrical continuity between the JFET drain andthe external lead. A construction on the surface of the support structure is positioneddirectly under the source region on the bottom of the JFET die and forms electricalcontinuity between the JFET source and a second external lead.
申请人：LOVOLTECH, INC.
代理机构：Wagner, Murabito & Hao LLP
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