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专利名称:POLYAMIC ACID, POLYIMIDE, POLYAMIC
ACID SOLUTION, POLYIMIDE SOLUTION,POLYIMIDE FILMS OBTAINED FROM THESESOLUTIONS, AND USE OF POLYIMIDE FILMS
发明人:Mari Fujii,Shinji Ozawa申请号:US14125688申请日:20120612
公开号:US20140093715A1公开日:20140403
摘要:Objects of the present invention are: to obtain a polyimide that is excellent inheat resistance, transparency, and optical isotropy and is soluble in an organic solvent; toprovide, by using either a polyimide or a polyamic acid which is a precursor or thepolyimide, a product or a member that is highly required to have heat resistance andtransparency; and particularly to provide a product and a member both of which areobtained by applying a polyamic acid solution and a polyimide solution of the presentinvention to the surface of an inorganic substance such as glass, metal, metal oxide, or asingle crystal silicon. These objects can be attained by a polyimide acid and a polyimidewhich are each prepared from an alicyclic tetracarboxylic dianhydride and a monomerhaving a fluorene structure.
申请人:Mari Fujii,Shinji Ozawa
地址:Shiga JP,Shiga JP
国籍:JP,JP
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