UBA2211

来源：99网

UBA2211

Half-bridge power IC family for CFL lamps

Rev. 2.1 — 7 March 2011

Preliminary data sheet

1. General description

The UBA2211 family of integrated circuits are a range of high voltage monolithic ICs for

driving Compact Fluorescent Lamps (CFL) in half-bridge configurations. The family is specifically designed to provide easy integration of lamp loads across a range of burner power and mains voltages.

Patented technologies and integrated protection types:

•Preheat state:

–Preheat applications: Adjustable current controlled preheat mode technology

enables the preheat time (tph) and preheat current to be set. This mode is triggered during start up.–Non-preheat applications: Glow-time control minimizes electrode damage just after ignition of the lamp.

•Saturation Current Protection (SCP): This protection is active during ignition

ensuring the lamp inductor can operate at the saturation current limit without exceeding the current ratings of the integrated half-bridge power transistors.

•RMS current control: The IC internally calculates the RMS current and changes the

frequency (fosc) to ensure the RMS current remains constant. RMS current control is active in the burn state ensuring a constant half-bridge burner current and IC dissipation. The nominal half-bridge burner current is set using the sense resistor (RSENSE).

•OverTemperature Protection (OTP) and Capacitive Mode Protection (CMP):

Overtemperature and capacitive mode protection monitor the application ensuring, in non-standard conditions, correct system shutdown and a safe condition at the burner’s end-of-life.

2. Features and benefits

2.1System integration

󰂄Integrated half-bridge power transistors

󰂋UBA2211A: 220 V mains; 13.5Ω; 0.9A maximum ignition current󰂋UBA2211B: 220 V mains; 9Ω; 1.35A maximum ignition current󰂋UBA2211C: 220 V mains; 6.6Ω; 1.85A maximum ignition current󰂄Integrated bootstrap diode󰂄Integrated high voltage supply

NXP Semiconductors

UBA2211

Half-bridge power IC family for CFL lamps

2.2Burner lifetime

󰂄󰂄󰂄󰂄

Current controlled preheat with adjustable preheat time and preheat currentMinimum glow time control to support cold start

Lamp power independent from mains voltage variationsLamp inductor saturation protection during ignition

2.3Safety

󰂄󰂄󰂄󰂄

Overtemperature protectionCapacitive mode protectionOverpower control

System shutdown at burner end of life

2.4Ease of use

󰂄Adjustable operating frequency for easy fit with various burners

󰂄Each device in the family incorporates the same controller functionality ensuring easy

power scaling and roll-out across a complete range of CFLs

3. Applications

󰂄Compact Fluorescent Lamps up to 25W for indoor and outdoor applications

4. Ordering information

Table 1.Ordering information

PackageName

Description

plastic dual in-line package; 8 leads (300 mil)

VersionSOT97-1

DIP8

Type numberUBA2211AP/N1UBA2211BP/N1UBA2211CP/N1UBA2211AT/N1UBA2211BT/N1UBA2211CT/N1

SO14

plastic small outline package; 14 leads; body width

3.9mm

SOT108-1

Preliminary data sheetRev. 2.1 — 7 March 2011 2 of 19

NXP Semiconductors

UBA2211

Half-bridge power IC family for CFL lamps

5. Block diagram

ClampCOUT1rectified mainsVDDCVDDLAMPCOUT2LlampVDDDVDTn.p. (5)HV6(3)CDVDTUBA2211startup7(6)n.p. (4)PGNDVDDVDDVO(ref)RMSOTPIsatresetLATCHresetsetGLOW AND IsatCONTROLPULSERC8(7)Cosc3(11)FSHSPTDRIVERHSPTCbsVDDRosc5(14)OUTVOLTAGECONTROLLEDOSCILLATOR:2VSWVSW(ph)burn stateRMS controlX2 − VO(ref)RMS2HS onfoscNON-OVERLAPLS onTIMERLSPTDRIVERLSPTRSENSESW1(8)CSW4(12)SENSEpreheatpreheatVO(ref)RMSVref(ph)SGND2(1, 2, 9, 10, 13)001aal990n.p. in the diagram means not present in DIP8 packageFig 1.Block diagramIn the SO14 package, the two diodes which are required for the DVDT supply are integrated and connected between pins DVDT and PGND.

In the DIP8 package, these diodes are not bonded out and need to be placed externally.

Preliminary data sheetRev. 2.1 — 7 March 2011 3 of 19

NXP Semiconductors

UBA2211

Half-bridge power IC family for CFL lamps

6. Pinning information

6.1Pinning

SGNDSGNDHVSWSGNDFSSENSE1234014aab0921234567014aab09314OUT13SGND12SENSE8RCVDDHVOUTPGNDDVDTVDDRCUBA2211T11FS10SGND98SGNDSWUBA2211P765Fig 2.Pin configuration for UBA2211XP (SOT97-1)Fig 3.Pin configuration for UBA2211XT (SOT108-1)6.2Pin description

Table 2.SymbolSWSGNDFSSENSEOUTHVVDDRCDVDTPGND

Pin description

UBA2211XPUBA2211XT12345678n.p.n.p.

1, 2, 9, 10, 1311121436754

sweep timing and VCO inputsignal ground

high-side floating supply output

voltage sense for preheat and RMS controlhalf-bridge outputhigh-voltage supply

internal low-voltage supply outputinternal oscillator inputDVDT supply inputDVDT supply groundDescription

Preliminary data sheetRev. 2.1 — 7 March 2011 4 of 19

NXP Semiconductors

UBA2211

Half-bridge power IC family for CFL lamps

7. Functional description

7.1Supply voltage

The UBA2211 family is powered using the start-up current source and the VDD supply.

When the voltage on pin HV increases, the VDD capacitor (CVDD) is charged using the internal Junction gate Field-Effect Transistor (JFET) current source. The voltage on pin VDD rises until VDDequalsVDD(start). The start-up current source is then disabled. The half-bridge starts switching causing the charge pump activate and in turn supply VDD. The amount of current flowing towards VDD equals VHV×CDVDT×f where f represents the momentary frequency. The charge pump consists of an external half-bridge capacitor (CDVDT). The SO14 package contains two internal diodes with an internal Zener diode. However, with the DIP8 package, these diodes must be mounted externally. The Zener diode ensures the VDD voltage cannot rise above the maximum VDD rating.

The DVDT supply has its own ground pin (PGND) to prevent large peak currents from flowing through the external small signal ground pin (SGND).

The start-up current source is enabled when the voltage on pin VDDis belowVDD(stop).

7.2Start-up state

When the supply voltage on pin VDD increases, the IC enters the start-up state. In the start-up state the High-Side Power Transistor (HSPT) is switched off and the Low-Side Power Transistor (LSPT) is switched on. The circuit is reset and the capacitors on the bootstrap pinFS (Cbs) and the low-voltage supply pin VDD (CVDD) are charged. Pins RC and SW are switched to ground.

When pin VDDis above VDD(start), the start-up state is exited and the preheat state is entered. If the voltage on pin VDDfalls below VDD(stop), the system returns to the start-up state.

Remark: If OTP is active, the IC remains in the start-up state for as long as this is the case. The VDD voltage slowly oscillates between VDD=VDD(stop) and VDD=VDD(start).

7.3Reset

A DC reset circuit is incorporated in the high-side driver. The high-side transistor is switched off when the voltage on pin FS is below the high-side lockout voltage.

7.4Oscillation control

The oscillation frequency is based on the 555-timer function. A self oscillating circuit is created comprising the external components: resistors Rosc, RSENSE and capacitor Cosc. The nominal oscillating frequency is determined by Rosc and Cosc.

An internal divider 0.5×fosc(int) is used to generate the accurate 50% duty cycle. The divider sets the bridge frequency at half the oscillator frequency.

Signal VSW is generated by the input on pin SW and it is used to determine the frequency in all states except preheat. Signal VSW(ph) is an internally generated signal used to determine the frequency during the preheat state.

UBA2211

All information provided in this document is subject to legal disclaimers.

Preliminary data sheetRev. 2.1 — 7 March 2011 5 of 19

NXP Semiconductors

UBA2211

Half-bridge power IC family for CFL lamps

The output voltage of the bridge changes with the falling edge of the signal on pin RC. The nominal half-bridge frequency is shown in Equation1:1

-fosc(nom)=------------------------------------------kosc×Rosc×Cosc

(1)

The maximum frequency is 2.5 × fosc(nom) and is set at VSW. An overview of the oscillator, internal LSPT and HSPT drive signals and the output is shown in Figure4.

VRC0time (s)HSPT driver0time (s)LSPT driver0VOUThalf-bridge0time (s)001aam035time (s)Fig 4.Oscillator, HSPT/LSPT drivers and output signals7.5Preheat state

As described in Section7.2, the IC enters the preheat state when the voltage on pin VDDis above VDD(start) and OTP is not active. The capacitor on pin SW (CSW) is charged by the sweep current (ISW). The preheat Operational Transconductance Amplifier (OTA) is enabled and the half-bridge circuit starts oscillating.

The preheat current is monitored using the external RSENSE resistor. The OTA controls the frequency using output voltage VSW(ph) so that the peak voltage across RSENSE equals the internal reference voltage (Vref(ph)). The peak voltage is the voltage at the end of the LSPT conduction time. The preheat peak current through the lamp filament is calculated as shown in Equation2:Vref(ph)

Iph(peak)=-----------------RSENSE

(2)

The preheat time is set by the external capacitor (CSW). The preheat state ends when the down-going CSW voltage equals VSW(ph); see Figure4.

If during the preheat time, capacitive mode is sensed, the internal VSW HIGH node is discharged and the frequency sweep restarts at fmax.

UBA2211

All information provided in this document is subject to legal disclaimers.

Preliminary data sheetRev. 2.1 — 7 March 2011 6 of 19

NXP Semiconductors

UBA2211

Half-bridge power IC family for CFL lamps

Vlamp2.5 × fosc(nom)fosc(int)fosc(nom)VSW HIGH0.6 × VH(RC)VSW(ph)VSW0preheat timeignitiontime (s)RMS control001aal992Fig 5.fosc(nom), VSW, VSW(ph) and Vlamp plotted against time7.6Ignition state

The ignition state is entered after the preheat state has finished. The capacitor on pin SW (CSW) is charged by ISW up to 0.6×VH(RC) which corresponds to the frequency fosc(nom).During this frequency sweep, the resonance frequency is reached resulting in the ignition of the lamp (see Figure4). The resonance frequency is set by the lamp inductor (Llamp) and lamp capacitor (Clamp). The ignition state ends when the voltage on pin SW (VSW) reaches 0.6×VH(RC).

7.7Steady state

In the steady state, the RMS current control is active. This control sets the frequency so that the RMS voltage across the sense resistor (RSENSE) is equal to VO(ref)RMS. This ensures the current through the power switches and through the lamp is constant. This results in constant IC dissipation and temperature at a fixed ambient temperature.During one oscillator clock cycle, the voltage on pin SENSE (VSENSE) is squared and converted into a positive current. This discharge current is added to the capacitor CSW.During the other oscillator clock cycle, the input of the squarer is connected to the internal reference voltage VO(ref)RMS. This voltage is squared and converted into a negative current. This charge current is also added to capacitor CSW. When both currents are equal, then Equation3 is true:

Preliminary data sheetRev. 2.1 — 7 March 2011 7 of 19

NXP Semiconductors

UBA2211

Half-bridge power IC family for CFL lamps

Tosc

1---------×Tosc

∫

SENSE(t)DT

1=---------×Tosc

∫

O(ref)RMSDT

(3)

Where Tosc equals the operating frequency fosc/1. Taking the square root of both sides results in Equation4:1---------×Toscor

RMS VSENSE=VO(ref)RMS=RSENSE×ILSPT

(5)

Tosc

∫

SENSE(t)DT

1---------×Tosc

Tosc

∫

O(ref)RMSDT

(4)

A constant current flows through the power switches and the lamp which is defined by the internal reference voltage (VO(ref)RMS) and the external RSENSE resistor.

The RSENSE resistor sets both the preheat current and the RMS half-bridge current. The ratio between them is fixed. However by adding a resistor in parallel to Csw (see Figure7) this ratio can be adjusted. This is described in more detail in the UBA2211 user manual.

7.8Non-overlap time

The non-overlap time is defined as the time when both MOSFETs are not conducting. The non-overlap time is fixed internally.

7.9OverTemperature Protection (OTP)

OTP is active in all states. When the die temperature reaches the OTP activation

threshold (Tth(act)otp), the oscillator is stopped and the power switches (LSPT/HSPT) are set to the startup state. When the oscillator is stopped, the DVDT supply no longer generates the supply current IDVDT. Voltage VDD gradually decreases and the start-up state is entered as described in Section7.2 on page5. OTP is reset when the temperature7.10Minimum glow time control

If the preheat time is set too short or omitted, the lamp electrodes do not have the correct temperature in the ignition state. This results in instant light but also in a reduced

switching lifetime because when the electrode temperature is too low electrode sputtering and damage occur. The minimum glow time control minimizes electrode damage by ensuring maximum power use during the glow phase to heat the electrodes heat as quickly as possible (see Figure6).

Preliminary data sheetRev. 2.1 — 7 March 2011 8 of 19

NXP Semiconductors

UBA2211

Half-bridge power IC family for CFL lamps

Vlamp2.5 × fosc(nom)fosc(int)fosc(nom)VSW HIGH0.6 × VH(RC)VSW(ph)VSW(ph)0preheat timeignitionglowVSWtime (s)RMS control001aal991Fig 6.fosc(nom), VSW, VSW(ph) and Vlamp plotted against time. The glow time control is active as tph is too short to preheat the electrodes7.11Saturation Current Protection (SCP)

A critical parameter in the design of the lamp inductor is its saturation current. When the momentary inductor exceeds its saturation current, the inductance drops significantly. If this happens, the inductor current and the current flowing through the LSPT and HSPT power switches increases rapidly. This can cause the current to exceed the half-bridge power transistors maximum ratings.

Saturation of the lamp inductor is likely to occur in cost-effective and miniaturized CFLs. The UBA2211 family internally monitors the power transistor current. When this current exceeds the momentary rating of the internal half-bridge power transistors, the conduction time is reduced and the frequency is slowly increased (by discharging CSW). This causes the system to balance at the edge of the current rating of the power switches.

7.12Capacitive Mode Protection (CMP)

When capacitive mode is detected, capacitor CSW is discharged causing the frequency to increase. The system sets itself to the operating point where capacitive mode switching is minimized. CMP is active during the ignition state and in the steady state.

If capacitive mode is sensed during the preheat time, the oscillator restarts at fmax. CMP could be triggered by an end of lamp life condition when a lamp electrode is broken.

Preliminary data sheetRev. 2.1 — 7 March 2011 9 of 19

NXP Semiconductors

UBA2211

Half-bridge power IC family for CFL lamps

8. Limiting values

Table 3.Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).SymbolParameterVHV

voltage on pin HV

Conditionsoperating

mains transients: 10 minutes maximum over lifetime

VFSVDDVSENSEVRCVSWIOUT

voltage on pin FSsupply voltagevoltage on pin SENSEvoltage on pin RCvoltage on pin SWcurrent on pin OUT

IRC<1mAISW<1mATj<125°CUBA2211AXUBA2211BXUBA2211CX

IDVDTSRTjTstgVESD

current on pin DVDTslew rate

junction temperaturestorage temperatureelectrostatic discharge voltage

HBM:

pins HV, FS, OUTpins SW, RC, VDD, DVDTMM:all pinsCDM:all pins

[1][2][3]

X where the last letter is P or T.

In accordance with the Human Body Model (HBM): equivalent to discharging a 100 pF capacitor through a 1.5kΩ series resistor.

In accordance with the Machine Model (MM): equivalent to discharging a 200 pF capacitor through a 1.5kΩ series resistor and a 0.75 μH inductor.

[3][3][2][1]

Min--00−500−0.9−1.35−1.65−0.9−4−40−55----

Max3735501415+5VDDVDD+0.9+1.35+1.65+0.9+4+150+15010002500250500

UnitVVVVVVVAAAAV/ns°C°CVVVV

with respect to pin OUTDC supply

Tj<125°C

repetitive output on pin OUT

Preliminary data sheetRev. 2.1 — 7 March 2011 10 of 19

NXP Semiconductors

UBA2211

Half-bridge power IC family for CFL lamps

9. Thermal characteristics

Table 4.SymbolRth(j-a)Rth(j-c)

[1]

Thermal characteristicsParameter

thermal resistance from junction to ambientthermal resistance from junction to case

Conditionsin free airin free air

[1][1]

Typ9516

UnitK/WK/W

In accordance with IEC 60747-1

10. Characteristics

Table 5.Characteristics

Tj = 25 °C; all voltages are measured with respect to SGND; positive currents flow into the IC.SymbolVHVVFS

Start-up stateIHVVDD(start)VDD(stop)VDD(hys)VDD(reg)Isink

Output stageRon

on-state resistance

high-side transistor:

UBA2211AX; VHV=310V; ID=100mAUBA2211BX; VHV=310V; ID=100mAUBA2211CX; VHV=310V; ID=100mAlow-side transistor:UBA2211AX; ID=100mAUBA2211BX; ID=100mAUBA2211CX; ID=100mA

Ron(150)/Ron(25)VF

on-state resistance ratio (150°Cto 25 °C)forward voltage

HS; IF=200mALS; IF=200mA

bootstrap diode; IF = 1 mA

tnoVFSIFS

non-overlap timevoltage on pin FScurrent on pin FS

lockout voltage

VHV=310V; VFS=12V

[1][1]

Parametervoltage on pin HVvoltage on pin FS

Conditions

t<10 minutes; IHV<30μAt<10 minutes; IHV<30μA

Min00

Typ--

Max5505

UnitVV

High-voltage supply

Low-voltage supply

current on pin HVstart supply voltagestop supply voltagehysteresis of supply voltageregulation supply voltagesink current

capability of VDD regulatorVHV=100Voscillation startoscillation stopstart − stop

-10.783-6

0.8511.78.53.513.8--12.794--mAVVVVmA

---------0.71.053.610

13.59.36.613.58.26.61.7--1.01.354.214

-------2.02.01.31.654.818

ΩΩΩΩΩΩ

VVVμsVμA

Preliminary data sheetRev. 2.1 — 7 March 2011 11 of 19

NXP Semiconductors

UBA2211

Half-bridge power IC family for CFL lamps

Table 5.Characteristics …continued

Tj = 25 °C; all voltages are measured with respect to SGND; positive currents flow into the IC.SymbolIsat

Parametersaturation current

Conditionshigh-side transistor:

UBA2211AX; VDS=30V; Tj≤125°C; VHV=310V

UBA2211BX; VDS=30V; Tj≤125°C; VHV=310V

UBA2211CX; VDS=30V; Tj≤125°C; VHV=310Vlow-side transistor:

UBA2211AX; VDS=30V; Tj≤125°CUBA2211BX; VDS=30V; Tj≤125°CUBA2211CX; VDS=30V; Tj≤125°C

Internal oscillatorfosc(int)fosc(nom)

internal oscillator frequencynominal oscillator frequency

VSW = VDD

Rosc=100kΩ; Cosc=220pF; VSW=VDD

Rosc=100kΩ; Cosc=220pF; ΔT=−20to+150°C

-40.05-0.3710.028

trip point; VH(RC)=kH×VDDtrip point; VL(RC)=kL×VDDRosc=100kΩ; Cosc=220pF

4.080.3081.065-CSW=100nF

-262155--60

kHz

41.3242.68kHz2

[1][1]

Min0.901.351.85

Typ---

Max---

UnitAAA

0.901.351.85

---

AAA

Δfosc(nom)/ΔTnominal oscillator frequency

variation with temperaturekHkLVH(RC)VL(RC)KoscVref(ph)tph

VO(ref)RMSTth(act)otpTth(rel)otp

[1]

high-level trip point factorlow-level trip point factorHIGH-level voltage on pin RCLOW-level voltage on pin RCoscillator constantpreheat reference voltagepreheat time

RMS reference output voltageovertemperature protection

activation threshold temperatureovertemperature protection release threshold temperature

0.3840.3970.0320.03.221.16201.5285175100

4.371.135--308--mVsmV°C°CV

0.3520.396V

Preheat function

RMS current control functionOTP function

X where the last letter is P or T.

Preliminary data sheetRev. 2.1 — 7 March 2011 12 of 19

NXP Semiconductors

UBA2211

Half-bridge power IC family for CFL lamps

11. Application information

LFILTD1D4COUT1LlampLAMPClampU1SGNDSGNDHV1234567141312OUTSGNDSENSEFSSGNDSGNDSWCSWCDVDTL_NAC inputL_LRfuseRoscCBUFCFSPGNDDVDTVDDRCCoscUBA2211111098RSENSED2D3COUT2CVDD001aal993Fig 7.Application diagramUBA2211All information provided in this document is subject to legal disclaimers.© NXP B.V. 2011. All rights reserved.

Preliminary data sheetRev. 2.1 — 7 March 2011 13 of 19

NXP Semiconductors

UBA2211

Half-bridge power IC family for CFL lamps

12. Package outline

DIP8: plastic dual in-line package; 8 leads (300 mil)SOT97-1

Dseating planeMEA2ALA1cZeb1wM(e )1b2MHb85pin 1 indexE1405scale10 mmDIMENSIONS (inch dimensions are derived from the original mm dimensions)UNITmminchesAmax.4.20.17A 1min.0.510.02A 2max.3.20.13b1.731.140.0680.045b10.530.380.0210.015b21.070.0.0420.035c0.360.230.0140.009D(1)9..20.390.36E(1)6.486.200.260.24e2.540.1e17.620.3L3.603.050.140.12ME8.257.800.320.31MH10.08.30.390.33w0.2540.01Z(1)max.1.150.045Note1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. OUTLINEVERSIONSOT97-1 REFERENCES IEC050G01 JEDECMO-001 JEITASC-504-8EUROPEANPROJECTIONISSUE DATE99-12-2703-02-13Fig 8.

UBA2211

Package outline SOT97-1 (DIP8)

All information provided in this document is subject to legal disclaimers.

Preliminary data sheetRev. 2.1 — 7 March 2011 14 of 19

NXP Semiconductors

UBA2211

Half-bridge power IC family for CFL lamps

SO14: plastic small outline package; 14 leads; body width 3.9 mmSOT108-1

DEAXcyHEvMAZ148QA2pin 1 indexA1(A )3θLpA17LwMdetail Xebp02.5scale5 mmDIMENSIONS (inch dimensions are derived from the original mm dimensions)UNITmmAmax.1.75A10.250.10A21.451.25A30.250.01bp0.490.36c0.250.19D(1)8.758.55E(1)4.03.80.160.15e1.270.05HE6.25.8L1.05Lp1.00.4Q0.70.60.0280.024v0.250.01w0.250.01y0.10.004Z(1)0.70.30.0280.012θoinches0.0690.0100.0570.0040.0490.0190.01000.350.0140.00750.340.2440.0390.0410.2280.0168o0Note1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. OUTLINEVERSION SOT108-1 REFERENCES IEC 076E06 JEDEC MS-012 JEITAEUROPEANPROJECTIONISSUE DATE99-12-2703-02-19Fig 9.

UBA2211

Package outline SOT108-1 (SO14)

All information provided in this document is subject to legal disclaimers.

Preliminary data sheetRev. 2.1 — 7 March 2011 15 of 19

NXP Semiconductors

UBA2211

Half-bridge power IC family for CFL lamps

13. Revision history

Table 6.Revision history

Release date20110307

Data sheet statusPreliminary data sheetObjective data sheetObjective data sheet

Change notice---SupersedesUBA2211 v.2UBA2211 v.1-

Document IDUBA2211 v.2.1Modifications:UBA2211 v.2UBA2211 v.1

•

Data sheet status change from objective data sheet to preliminary data sheet.

2011010320100628

Preliminary data sheetRev. 2.1 — 7 March 2011 16 of 19

NXP Semiconductors

UBA2211

Half-bridge power IC family for CFL lamps

14. Legal information

14.1 Data sheet status

Document status[1][2]Objective [short] data sheetPreliminary [short] data sheetProduct [short] data sheet

[1][2][3]

Product status[3]DevelopmentQualificationProduction

Definition

This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.

Please consult the most recently issued document before initiating or completing a design. The term ‘short data sheet’ is explained in section “Definitions”.

The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status

information is available on the Internet at URLhttp://www.nxp.com.

14.2 Definitions

Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of

information included herein and shall have no liability for the consequences of use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.

Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet.

malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental

damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk.

Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification.

Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of

customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products.

NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP

Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer.

No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities.

14.3 Disclaimers

Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information.

In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors.Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof.

Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or

UBA2211

All information provided in this document is subject to legal disclaimers.

Preliminary data sheetRev. 2.1 — 7 March 2011 17 of 19

NXP Semiconductors

UBA2211

Half-bridge power IC family for CFL lamps

NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications.

Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of

non-automotive qualified products in automotive equipment or applications.In the event that customer uses the product for design-in and use in

automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond

14.4 Trademarks

Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.

15. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Preliminary data sheetRev. 2.1 — 7 March 2011 18 of 19

NXP Semiconductors

16. Contents

1 General description. . . . . . . . . . . . . . . . . . . . . . 12 Features and benefits . . . . . . . . . . . . . . . . . . . . 12.1 System integration . . . . . . . . . . . . . . . . . . . . . . 12.2 Burner lifetime . . . . . . . . . . . . . . . . . . . . . . . . . 22.3 Safety. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22.4 Ease of use. . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Applications. . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Ordering information. . . . . . . . . . . . . . . . . . . . . 25 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 36 Pinning information. . . . . . . . . . . . . . . . . . . . . . 46.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 47 Functional description . . . . . . . . . . . . . . . . . . . 57.1 Supply voltage . . . . . . . . . . . . . . . . . . . . . . . . . 57.2 Start-up state . . . . . . . . . . . . . . . . . . . . . . . . . . 57.3 Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57.4 Oscillation control. . . . . . . . . . . . . . . . . . . . . . . 57.5 Preheat state . . . . . . . . . . . . . . . . . . . . . . . . . . 67.6 Ignition state. . . . . . . . . . . . . . . . . . . . . . . . . . . 77.7 Steady state . . . . . . . . . . . . . . . . . . . . . . . . . . . 77.8 Non-overlap time . . . . . . . . . . . . . . . . . . . . . . . 87.9 OverTemperature Protection (OTP) . . . . . . . . . 87.10 Minimum glow time control. . . . . . . . . . . . . . . . 87.11 Saturation Current Protection (SCP) . . . . . . . . 97.12 Capacitive Mode Protection (CMP) . . . . . . . . . 98 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 109 Thermal characteristics . . . . . . . . . . . . . . . . . 1110 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . 1111 Application information. . . . . . . . . . . . . . . . . . 1312 Package outline. . . . . . . . . . . . . . . . . . . . . . . . 1413 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 1614 Legal information. . . . . . . . . . . . . . . . . . . . . . . 1714.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 1714.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 1714.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 1714.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 1815 Contact information. . . . . . . . . . . . . . . . . . . . . 1816

Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

UBA2211

Half-bridge power IC family for CFL lamps

Please be aware that important notices concerning this document and the product(s)described herein, have been included in section ‘Legal information’.

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 7 March 2011Document identifier: UBA2211

因篇幅问题不能全部显示，请点此查看更多更全内容

查看全文

全部频道

UBA2211