专利内容由知识产权出版社提供
专利名称：Probe assembly for measuring conductivity
of plated through holes
发明人：Robert O. Wahl,Derek Lieber,Jay M. Lesser申请号：US06/048547申请日：19790614公开号：US042451A公开日：19810113
摘要：An improved probe assembly for measuring the conductivity of a platedthrough hole in a circuit board. The probe assembly having a longitudinal housing andincluding at the forward end thereof a segmented current injection electrode, eachsegment being spring biased forwardly and capable of independent movementlongitudinally with respect to the housing between a forward position and rearwardposition. The segmented current injection electrode injecting current into the throughhole substantially 360° of the circular edge formed by the intersection of the wallsdefining the through hole and the surface of the circuit board. A voltage measurementelectrode being a knife-blade electrode is positioned in the interstices between thesegments of the current injection electrode. The voltage measurement electrode alsobeing spring biased in a forward direction and capable of longitudinal movement
between a forward position and a rearward position. The voltage measurement electrodecontacting the circular edge of the through hole at multiple points to insure a goodelectrical contact for voltage measurement.
申请人：UPA TECHNOLOGY, INC.
代理机构：Nims, Howes, Collison & Isner
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