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专利名称：NO FLOW UNDERFILL COMPOSITION发明人：XIAO, Yue,TONG, Quinn, K.,MORGANELLI,
Paul,SHAH, Jayesh
申请号：EP03734967.7申请日：20030121公开号：EP1470176B1公开日：20070627
摘要：A curable underfill encapsulant composition which is especially useful in the no-flow encapsulation process. The composition contains a thermal curable resin systemcomprising an admixing of at least one epoxy resin and a phenol-containing compoundsuch as phenol or phenolic resin, an imidazole-anhydride adduct as a catalyst, and afluxing agent. Various additives, such as air release agents, flow additives, adhesionpromoters and rheology modifiers may also be added as desired.
申请人：NAT STARCH CHEM INVEST
地址：US
国籍：US
代理机构：Held, Stephan
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