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专利名称：No flow underfill composition发明人：Yue Xiao,Quinn K. Tong,Paul
Morganelli,Jayesh Shah
申请号：US10062902申请日：20020131
公开号：US20030162911A1公开日：20030828
摘要：A curable underfill encapsulant composition which is especially useful in the no-flow encapsulation process. The composition contains a thermal curable resin systemcomprising an admixing of at least one epoxy resin and a phenol-containing compoundsuch as phenol or phenolic resin, an imidazole-anhydride adduct as a catalyst, and afluxing agent. Various additives, such as air release agents, flow additives, adhesionpromoters and rheology modifiers may also be added as desired.
申请人：XIAO YUE,TONG QUINN K.,MORGANELLI PAUL,SHAH JAYESH
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