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专利名称：Improvements in or relating to filters发明人：ROGER W. WHATMORE,EIJU KOMURO申请号：AU7080001申请日：20010711公开号：AU7080001A公开日：20020121
摘要：A method is provided by which filters consisting of a plurality of think film bulkacoustic resonators (FBAR) fabricated on a semiconductor wafer such as silicon or someother type of wafer can be hermetically packaged in a way that presents a componentwhich can be easily handled by conventional pick-and-place machines. This packageconsists of a sandwich of the wafer (1) bearing the thin film piezoelectric resonator (2)and at least one silicon wafer (8. 14). The bond between these wafers (1. 8. 14) is
accomplished by some means such as anodic bonding, using a low melting point glass ora metal bonding layer. Contacts to the resonating components are accomplished byetching holes (12) through one of the bonded wafers (18) using a process such as deepreactive ion etching. Contact electrodes are deposited into the holes (12) and onto thesurface of the wafer bearing the holes (12). The resulting chip components are separatedprior to use by sawing or some other method . As an alternative etching, contactelectrodes can be deposited onto the edges of the chips after separation.
申请人：CRANFIELD UNIVERSITY
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